Heat Dissipation Equations:
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Heat dissipation in PCBs refers to how effectively a printed circuit board can transfer heat away from components. Proper thermal management is crucial for reliability and preventing component failure.
The calculator uses two fundamental equations:
Where:
Explanation: The first equation calculates power dissipation from current and resistance, while the second calculates thermal resistance based on material properties and geometry.
Details: Accurate thermal calculations help prevent overheating, ensure component longevity, and maintain system reliability in electronic designs.
Tips: Enter all values in the specified units. Current and resistance are needed for power calculation. Length, conductivity, and area are needed for thermal resistance calculation.
Q1: What's a typical thermal conductivity for PCB materials?
A: FR4 is about 0.3 W/mK, while metal-core PCBs can be 1-400 W/mK depending on the metal used.
Q2: How does power dissipation affect PCB design?
A: High power dissipation may require larger traces, heatsinks, or thermal vias to prevent excessive temperature rise.
Q3: What's an acceptable thermal resistance value?
A: This depends on the application, but lower is generally better. Values under 10 K/W are typical for many applications.
Q4: How accurate are these calculations?
A: They provide good estimates but real-world conditions (airflow, nearby components) may affect actual performance.
Q5: Should I include safety margins?
A: Yes, it's recommended to include at least 20-30% safety margin in thermal designs.